by dkatz42 » Tue Dec 30, 2008 11:24 pm
It would require a different chassis. Currently, the modules are mechanically stabilized by the monolithic faceplate, which is tied to the chassis at the corners. If you have separate faceplates, there's nothing to tie them to the chassis, and so they're mechanically suspended off the front of each module, which means both that the modules are mechanically secured only by the XLR connectors on the back, and that the mass of the individual faceplate is adding additional stress.
Further, there would no longer be a reliable ground connection, and so you'd be in hum hell.
One could imagine a new chassis that is tapped on a per-module basis, and the individual faceplates would be tied to the chassis and support the modules, rather than the other way around, but I'll leave it to Tim to figure out the cost/benefit analysis.